Electronic Science and Technology ›› 2019, Vol. 32 ›› Issue (3): 72-76.doi: 10.16180/j.cnki.issn1007-7820.2019.03.015

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Research on the Partial Key Factors Affecting the Junction Temperature of High Power LED Lamp Chip

XIAO Yuanbin,YANG Ping   

  1. School of Mechanical Engineering,Jiangsu University,Zhenjiang 212013,China
  • Received:2018-03-18 Online:2019-03-15 Published:2019-03-01
  • Supported by:
    National Natural Science Foundation of China(51575246)


Due to the problem of high junction temperature during the lighting of LED lamp chips,two key factors affecting the junction temperature: distance between the light sources in the LED lamp chip and the spacing between the chips were studied in order to effectively reduce the junction temperature of the chip. This paper used ANSYS Workbench16.0 software for chip thermal simulation and verified the reliability of simulation results by the constant temperature test platform. The simulation results showed that properly setting the spacing between the internal light sources of the LED lamp chip could effectively reduce the chip junction temperature by 8.249℃ while appropriately increasing the spacing between LED lamp chips could also effectively reduce the junction temperature by 0.5℃.

Key words: junction temperature, LED lights, chip spacing, arrangement mode, light source spacing, tube pin temperature

CLC Number: 

  • TN312.8