50 μm级D形硬质合金微铣刀铣削纯铜试验研究

doi:10.16180/j.cnki.issn1007-7820.2021.01.007

Abstract

Abstract:

According to the requirement of miniaturization and high precision of folded waveguide slow wave structure, D-Shaped micro-milling cutter with diameter of 50 μm is fabricated by WEDG with the self-developed μEM-200CDS2 combined high precision machine tool. The surface quality of the microgroove is studied by the process test on the pure copper workpiece. White-light interferometer, ultra-depth-of-field microscope and scanning electron microscope are used to observe the variation of surface morphology and roughness of micro-grooves with milling distance, and the surface quality and burr formation during micro-milling are analyzed. These results show that the revolving track of the groove bottom tool is firstly concentrated in the cutting direction of the tool, and with the tool wear, it turnes to the feed direction of the tool. The burrs on the milling side of the micro groove are more than those on the reverse side, and increases with the increase of milling distance. Additionally, the roughness of the groove bottom increases with the linear growth trend.

Key words: folded waveguide slow wave structure, wire electro-discharge grinding, D-shaped micro-milling cutter, surface quality, burr formation, roughness

CLC Number:

TN605

YAN Guanghe, JIANG Chen, ZHANG Yongbin, HONG Xiaolan, QIAN Dabing. Experimental Study on Milling Pure Copper with 50 μm D-Shaped Cemented Carbide Micro-Milling Cutter[J].Electronic Science and Technology, 2021, 34(1): 36-42.

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硬质合金
密度ρ/g·cm^-3	14.40
弹性模量E/GPa	800
泊松比μ	0.22
硬度HV/MPa	1 900
晶粒度Z_v/μm	0.4
Co含量/%	9
抗弯强度f/N·mm^-2	4 000

Experimental Study on Milling Pure Copper with 50 μm D-Shaped Cemented Carbide Micro-Milling Cutter

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