›› 2013, Vol. 26 ›› Issue (10): 91-.

• Articles • Previous Articles     Next Articles

BiAgSbCu-based High-temperature Lead-free Solder Preparation and its Welding Performance

 TU Wen-Bin, ZHOU Guang-Xiong   

  1. (School of Materials and Energy,Guangdong University of Technology,Guangzhou 510006,China)
  • Online:2013-10-15 Published:2013-10-23


The development of high melting temperature lead-free solder with melting point above 260 ℃ to replace the traditional high lead solder used for electronic packaging has been a major difficulty in the field of soldering.Bi-2.6 Ag-5 Sb solder alloy whose melting point is 272 ℃ is restricted because of its inferior wettability and soldering reliability.In this paper,Cu is added into Bi-2.6 Ag-5 Sb solder alloy to improve the wettability and soldering reliability.The results show that there is no obvious change in the melting points of BiAgSbCu solder alloy with the addition of Cu,while the wettability and soldering reliability of BiAgSbCu solder alloy improve remarkably with the addition of 2%Cu.

Key words: high melting temperature lead-free solder;wettability;shear strength;microstructural

CLC Number: 

  • TN604