西安电子科技大学学报 ›› 2023, Vol. 50 ›› Issue (6): 34-43.doi: 10.19665/j.issn1001-2400.20230502

• 电磁空间安全专栏 • 上一篇    下一篇

p-GaN HEMT 强电磁脉冲损伤效应与防护设计研究

王蕾(),柴常春(),赵天龙(),李福星(),秦英朔(),杨银堂()   

  1. 西安电子科技大学 微电子学院,陕西 西安 710071
  • 收稿日期:2023-01-14 出版日期:2023-12-20 发布日期:2024-01-22
  • 通讯作者: 赵天龙(1988—),男,讲师,E-mail:zhaotl@xidian.edu.cn
  • 作者简介:王蕾(1989—),女,西安电子科技大学博士研究生,E-mail:lwang2020@stu.xidian.edu.cn;|柴常春(1960—),男,教授,E-mail:ccchai@mail.xidian.edu.cn;|李福星(1996—),男,西安电子科技大学博士研究生,E-mail:lwang2020@stu.xidian.edu.cn;|秦英朔(1998—),男,西安电子科技大学硕士研究生,E-mail:ysqin_chin@163.com;|杨银堂(1962—),男,教授,E-mail:ytyang@mail.xidian.edu.cn
  • 基金资助:
    国家自然科学基金(61974116)

Damage effect and protection design of the p-GaN HEMT induced by the high power electromagnetic pulse

WANG Lei(),CHAI Changchun(),ZHAO Tianlong(),LI Fuxing(),QIN Yingshuo(),YANG Yintang()   

  1. School of Microelectronics,Xidian University,Xi’an 710071,China
  • Received:2023-01-14 Online:2023-12-20 Published:2024-01-22

摘要:

如今,恶劣的电磁环境已经对电子系统的安全构成了严重威胁。氮化镓基高电子迁移率晶体管的优异性能使其更加适合于高功率,高频应用领域。随着晶体外延材料质量的不断提高和器件工艺的改进,氮化镓器件向高功率和小型化方向快速发展,器件的可靠性和稳定性受到巨大挑战。深入研究了增强型氮化镓高电子迁移率晶体管的强电磁脉冲损伤效应,通过分析器件内部多物理量分布的变化,探究其失效机理。研究结果表明,强电磁脉冲作用下器件的损伤主要是由自热效应、雪崩击穿和热载流子效应等不同的热累积效应引起的。在此基础上,进行了多重防护设计,并通过仿真研究进行了验证。结果表明,氧化铝作为钝化层材料可以增强器件的击穿特性,提高其抗电磁干扰能力;同时,也可以通过在源极和栅极串联电阻的方式提高器件的抗强电磁脉冲损伤能力。以上结论对于工作在恶劣电磁环境中氮化镓器件设计具有重要的参考意义。

关键词: 氮化镓, 电磁脉冲, 损伤效应, 防护设计

Abstract:

Nowadays,severe electromagnetic circumstances pose a serious threat to electronic systems.The excellent performance of gallium nitride based high electron mobility transistors makes them more suitable for high power and high frequency applications.With the continuous improvement in the quality of crystal epitaxial material and device manufacture technology,gallium nitride semiconductor devices are rapidly developing towards the direction of high power and miniaturization,which challenges the reliability and stability of devices.In this paper,the damage effects of the high power electromagnetic pulse(EMP) on the enhanced GaN high-electron-mobility transistor(HEMT) are investigated in detail.The mechanism is presented by analyzing the variation of the internal multiple physical quantities distribution in the device.It is revealed that the device damage is dominated by the different thermal accumulation effect such as self-heating,avalanche breakdown and hot carrier emission during the action of the high power EMP.Furthermore,the multi-scale protection design of the GaN HEMT against the high power electromagnetic interference(EMI) is presented and verified by simulation study.The device structure optimization results demonstrate that a proper passivation layer which enhances the breakdown characteristics can improve the anti-EMI capability.The circuit optimization presents the influences of external components on the damage progress.It is found that the resistive components which are in series at the source and gate will strengthen the capability of the device to withstand high power EMP damage.All above conclusions are important for device reliability design using gallium nitride materials,especially when the device operates under severe electromagnetic circumstances.

Key words: gallium nitride, electromagnetic pulse, damage effect, protection design

中图分类号: 

  • TN386