J4 ›› 2012, Vol. 39 ›› Issue (1): 49-55+104.doi: 10.3969/j.issn.1001-2400.2012.01.010

• 研究论文 • 上一篇    下一篇



  1. (1. 西安电子科技大学 宽禁带半导体材料与器件教育部重点实验室,陕西 西安  710071;
    2. 武警工程学院 通信工程系,陕西 西安  710086)
  • 收稿日期:2010-11-14 出版日期:2012-02-20 发布日期:2012-04-06
  • 通讯作者: 申振宁
  • 作者简介:申振宁(1976-),男,西安电子科技大学博士研究生,E-mail: zhenningshen@hotmail.com.
  • 基金资助:


New model decomposed method to simulate the  crosstalk between vias

SHEN Zhenning1,2;ZHUANG Yiqi1;ZENG Zhibin1

  1. (1. Ministry of Education Key Lab. of Wide Band-Gap Semiconductor Materials and Devices, Xidian Univ., Xi'an  710071, China;
    2. Dept. of Communication, Eng. College of CAPF, Xi'an  710086, China)
  • Received:2010-11-14 Online:2012-02-20 Published:2012-04-06
  • Contact: SHEN Zhenning



关键词: 高速电路, 电磁兼容, 串扰, 传输阻抗


A model decomposed method is proposed for efficient simulation of crosstalk between vias in high speed circuits. The 3D interconnect structure is first decoupled into a power-ground plane pair and a microstrip line structure which are coupled in the vias, then we solve each parts by using different methods, and finally, the equivalent circuits of each part are integrated to simulate the system performance. Compared with full wave simulation, the simulation time is reduced from 187 minutes to 4 minutes with considerable accuracy. The structure of the printed circuit board and vias that affect the system performance are analyzed carefully, and it is found that the crosstalk coefficient is approximately proportional to the magnitudes of transform impedance in the location of vias in the frequency domain. Some engineering implications on reducing crosstalk noise in practical PCB, such as using a thin dielectric layer, adding decoupling capacitors and adjusting the locations of the vias, are discussed through a series of simulation. The time domain simulation result shows that the magnitude of crosstalk noise is reduced by over 98% when the interconnect structure is designed properly.

Key words: high-speed circuits, electromagnetic compatibility, crosstalk, transform impedance


  • TP302.1