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Study of the ECR plasma etching process of PZT ferroelectric thin film materials

LOU Li-fei;XIAO Bin;WANG Jia-you;YANG Yin-tang;LI Yue-jin

  

  1. (The Ministry of Edu. Key Lab. of Wide Band-Gap Semiconductor Materials and Devices,
    Xidian Univ., Xi′an 710071, China)
  • Received:1900-01-01 Revised:1900-01-01 Online:2005-08-20 Published:2005-08-20

Abstract: Electron cyclotron resonance (ECR) etching of the lead zirconate titanate (PZT) ferroelectric thin films produced via sol-gel process has been performed in SF6 and the SF6+Ar mixtures. The dependence of the etching rate on the total flow rate, gas mixing ratio and microwave power density has been systematically investigated. Experimental results show that the maxima of the etching rate is reached when the gas mixing ratio is about 20%. The surface component X-ray photoelectron spectroscopy (XPS) of PZT thin films indicate that the ECR etching process in SF6 and the SF6+Ar mxtures yield a great decrease in Pb content in the composition of PZT thin films, and that the etching of TiO2 is the major factor in restricting the PZT thin films etching rate.

Key words: electron cyclotron resonance, plasma etching, lead zirconate titanate, sol-gel process

CLC Number: 

  • TN304.055