使用模式分解方法的过孔串扰机制研究

doi:10.3969/j.issn.1001-2400.2012.01.010

Abstract

Abstract:

A model decomposed method is proposed for efficient simulation of crosstalk between vias in high speed circuits. The 3D interconnect structure is first decoupled into a power-ground plane pair and a microstrip line structure which are coupled in the vias, then we solve each parts by using different methods, and finally, the equivalent circuits of each part are integrated to simulate the system performance. Compared with full wave simulation, the simulation time is reduced from 187 minutes to 4 minutes with considerable accuracy. The structure of the printed circuit board and vias that affect the system performance are analyzed carefully, and it is found that the crosstalk coefficient is approximately proportional to the magnitudes of transform impedance in the location of vias in the frequency domain. Some engineering implications on reducing crosstalk noise in practical PCB, such as using a thin dielectric layer, adding decoupling capacitors and adjusting the locations of the vias, are discussed through a series of simulation. The time domain simulation result shows that the magnitude of crosstalk noise is reduced by over 98％ when the interconnect structure is designed properly.

Key words: high-speed circuits, electromagnetic compatibility, crosstalk, transform impedance

CLC Number:

TP302.1

SHEN Zhenning;ZHUANG Yiqi;ZENG Zhibin. New model decomposed method to simulate the crosstalk between vias[J].J4, 2012, 39(1): 49-55+104.

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New model decomposed method to simulate the crosstalk between vias

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