Abstract: In the high speed multichip m
odule(MCM) design, signal integrity is pivotal. By means of a real fault-detect
or example, the paper gives an improved method for MCM placement and routing. Th
e analysis results of signal characteristics, such as reflection, delay and elec
tromagnetic interference, in both time domain and frequency domain, are discusse
d to optimize the circuit structure in the design process. Here we adopt 50M
Hz pulse signal as the trigger and utilize Spectra Quest software as the simul
ation tool. The simulation results show that the noise margin is up 124. 86m
V; the high overshoot and low down 180. 61mV, 465. 36mV respective
ly; the propagation delay, switch delay and settle delay down 0. 407835ns
, 0. 4188ns, 0. 35968ns respectively; the relative delay of in
put signals is not longer than 0. 2ns and the intensity of electromagnetic
interference is decreased 10% and above. The results above indicate that the a
djusted and optimized placement and routing design can meet the signal transmiss
ion requirements.

Key words: multichip module, placement and routing, electromagnetic interference