×
模态框(Modal)标题
在这里添加一些文本
Close
Close
Submit
Cancel
Confirm
×
模态框(Modal)标题
×
Toggle navigation
Home
About Journal
Editorial Board
Instruction
Subscription
Contact Us
中文
Calculation model for thermal-caused passive intermodulation product of microstrip lines
HE Yun;WANG Qi;HU Tiancun;WANG Xinbo;LI Jun;CUI Wanzhao;LIU Chunliang
Journal of Xidian University . 2017, (
3
): 120 -126 . DOI: 10.3969/j.issn.1001-2400.2017.03.021