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中文
Fatigue lifetime analysis of the electronic packaging structures under the combined thermal stress and vibration loading conditions
ZHAO Fubin,QIU Yuanying,JIA Fei,Ma Hongbo
Journal of Xidian University . 2019, (
2
): 54 -60 . DOI: 10.19665/j.issn1001-2400.2019.02.010
