微波负载电热耦合的无源互调分析

doi:10.3969/j.issn.1001-2400.2016.03.031

Abstract

Abstract:

Microwave loads are used to improve the matching performance of circuits and absorb the microwave energy. The microwave loads generate the joule heat to affect the electrical resistivity after consuming microwave energy which may produce the passive intermodulation (PIM). Electro-thermal compling leads to the difference of the time scale which produces PIM. In order to address the problem, the fractional heat conduction model of microwave loads is created by the fractional calculus firstly. Then the circuit model of the fractional heat conduction is established. Eventually, the thermal resistance effect is considered. The expression for the PIM power level caused by the coupled electro-thermal microwave loads is derived. The influences of the material's temperature coefficient of resistance, thermal resistance and thermal capacity to PIM are revealed, which provides the fundamental basis for reducing the PIM from the coupled electro-thermal microwave loads.
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Key words: microwave load, passive intermodulation, intermodulation distortion, fractional calculus, thermal-electric coupling, thermal resistance

JIANG Jie;LI Tuanjie;MEI Yujian;WANG Hongjun. Passive intermodulation analysis of coupled electro-thermal microwave loads[J].Journal of Xidian University, 2016, 43(3): 179-184.

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Passive intermodulation analysis of coupled electro-thermal microwave loads

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