J4 ›› 2009, Vol. 36 ›› Issue (6): 1039-1043.

• Original Articles • Previous Articles     Next Articles

X-band single stage GaN solid-state power amplifier

CHEN Chi;HAO Yue;FENG Hui;MA Xiao-hua;ZHANG Jin-cheng;HU Shi-gang   

  1. (Ministry of Education Key Lab. of Wide Band-Gap Semiconductor Materials and Devices, Xidian Univ., Xi'an  710071, China)
  • Received:2009-03-03 Online:2009-12-20 Published:2010-01-20
  • Contact: CHEN Chi E-mail:chenchi@mail.xidian.edu.cn

Abstract:

Based on the self-developed AlGaN/GaN HEMT with 2.5-mm gate width technology on the SiC substrate, the X-band GaN solid-state power amplifier module is fabricated. The module consists of the AlGaN/GaN HEMT, DC-bias circuit and microstrip line. The chamber structure made of metal and the test fixture are designed for grounding and thermal transmission under the CW operating condition. Two section bias circuits for the AlGaN/GaN HEMT are presented. The special R-C networks and gate resistance are used for cancellation of self-oscillation at both the low frequency and radio frequency. The microstrip stubs are used for input matching and output matching. Under the  Vds= 27V,  Vgs= -4.0V CW operating condition at  8GHz, the amplifier module exhibits a line gain of  5.6dB with a power-added efficiency of 30.5%, the output power of  40.25dBm (10.5W), and the power gain compression of  2dB. Between  8GHz and  8.5GHz, the variation of output power is  1dB.

Key words: AlGaN/GaN HEMT, solid-state power amplifier module, saturated output power, gain compression, power-added efficiency

CLC Number: 

  • TN325+.3