J4 ›› 2012, Vol. 39 ›› Issue (2): 164-167.doi: 10.3969/j.issn.1001-2400.2012.02.027

• Original Articles • Previous Articles     Next Articles

Investigation of the influence of deposition temperature on  ALD deposite HfO2 high k gate material

KUANG Qianwei;LIU Hongxia;FAN Jiwu;MA Fei;ZHANG Yanlei   

  1. (Ministry of Education Key Lab. of Wide Band-Gap Semiconductor Materials and Devices, Xidian Univ., Xi'an  710071, China)
  • Received:2011-01-14 Online:2012-04-20 Published:2012-05-21
  • Contact: KUANG Qianwei E-mail:kqw3606@sina.com

Abstract:

HfO2 high k dielectric films are deposited on Si(100) by the atomic layer deposition technique at different temperatures, and the influences of deposition temperature on the characteristic of HfO2 are investigated. Experimental results show that the deposition rate of HfO2 is seriously influenced by the deposition temperature, which will be rapidly increased with the increased deposition temperature in the high temperature region or the decreased temperature in the low temperature region. By analyzing the C-V characteristic of HfO2, it is found that both the dielectric constant and the quantity of oxide defects of HfO2 deposited at different temperatures change greatly, and HfO2 deposited at the temperature of 280-310℃ has the least oxide defects.

Key words: high k dielectric, HfO2, ALD, deposition temperature, oxide defect