J4 ›› 2012, Vol. 39 ›› Issue (5): 186-191.doi: 10.3969/j.issn.1001-2400.2012.05.031

• Original Articles • Previous Articles     Next Articles

CFD modeling of relaxation SiGe RPCVD

DAI Xianying;ZHENG Ruochuan;GUO Jingjing;ZHANG Heming;HAO Yue;SHAO Chenfeng;JI Yao;YANG Cheng   

  1. (Ministry of Education Key Lab. of Wide Band-Gap Semiconductor Materials and Devices, Xidian Univ., Xi'an  710071, China)
  • Received:2012-04-11 Online:2012-10-20 Published:2012-12-13
  • Contact: DAI Xianying E-mail:xydai@xidian.edu.cn

Abstract:

Based on the CVD growth principle of SiGe materials,CFD (Computational Fluid Dynamics) simulation model about kinetics of relaxation SiGe and the corresponding fluid model are built,for the reduced pressure chemical vapor deposition (RPCVD) system. We simulate and analyze the effects of flow, pressure, and rotation speed on the gas density field and the velocity field in the reaction chamber, by using CFD simulation software named Fluent. According to simulation results, when flow is 50L/min, pressure is 2666.44Paand  rotation speed is 35r/min, the uniformity of the flow field above the substrate is the best. We carry out the relaxation SiGe RPCVD experiment under optimized process conditions, and experimental results of SiGe film thickness distribution is consistent with the simulation result about the Fluent concentration distribution of the relaxation SiGe precursor SiH2Cl2, which proves the correctness of our model.

Key words: relaxation Silicon-Germanium, reduced pressure chemical vapor deposition, computational fluid dynamics model, density distribution