[1] Lee M L, Fitzgerald E A, Bulsara M T, et al. Strained Si, SiGe, and Ge Channels for High-mobility Metal-oxide-semiconductor Field-effect Transistors[J]. Appl Phys, 2005, 97(1): 1-27.
[2] Huang L J, Chu J O, Cananei D F, et al. SiGe-on-insulator Prepared by Wafer Bonding and Layer Transfer for High-performance Field-effect Transistors [J]. Applied Physics Letter, 2009, 78(9): 1267-1269.
[3] Hock G, Kohn E, Rosenblad C, et al. High Hole Mobility in SiGe Channel Meta-oxide Semiconductor Field-effect Transistors Grown by Plasma-enhanced Chemical Vapor Deposition[J]. Applied Physics Letter, 2000, 76(26): 3920-3922.
[4] Sutton A K, Haugerud B M, Yuan Lu, et al. Proton Tolerance of Fourth-generation 350 GHz UHVCVD SiGe HBTs. [J]. IEEE Trans on Nuclear Science, 2004, 51(6): 3736-3742.
[5] Hartmann J M, Burdin M, Rolland G, et al.Growth Kinetics of Si and SiGe on Si(1 0 0),Si(1 1 0) and Si(1 1 1) Surfaces [J]. Crystal Growth, 2006, 294: 288-295.
[6] Song Y J, Lim J W, Kang J Y, et al. High Transconductance Modulation-doped SiGe pMOSFETs by RPCVD [J]. Electronics Letters, 2002, 38(23): 1479-1480.
[7] 戴显英, 金国强, 董洁琼, 等. 锗硅/硅异质结材料的化学气相淀积生长动力学模型 [J]. 物理学报, 2011, 60(6): 065101-1-065101-7.
Dai Xianying, Jin Guoqiang, Dong Jieqiong ,et al. A Kinetics Model for the Chemical Vapor Deposition Growth of SiGe/Si Heterojunction Materials [J]. Acta Phys Sin, 2011, 60(6): 065101-1-065101-7.
[8] 金晓军, 梁骏吾. GeSi CVD系统的流体力学和表面反应动力学模型 [J]. 电子学报, 1996, 24(5): 7-12.
Jin Xiaojun, Liang Junwu.A Kinetics and Transport Model of GexSi1-x Chemical Vapor Epitaxy [J]. Acta Electronica Sinica, 1996, 24(5): 7-12.
[9] 王福军. 计算流体动力学分析——CFD软件原理与应用 [M]. 北京: 清华大学出版社, 2004.
[10] 徐谦, 左然, 张红. 反向流动垂直喷淋式MOCVD反应器设计与数值模拟 [J]. 人工晶体学报, 2005, 34(6):1059-1064.
Xu Qian, Zuo Ran, Zhang Hong. Design and Simulation of Reverse-flow Showerhead MOCVD Reactors [J]. Journal of Synthetic Crystals,2005, 34(6): 1059-1064.
[11] 李志明, 郝跃, 张进成, 等. 氮化物MOCVD反应室流场的仿真与分析 [J]. 人工晶体学报, 2010, 39(1): 226-232.
Li Zhiming, Hao Yue, Zhang Jincheng, et al. Simulation and Analysis of Flow Field in Nitride MOCVD Reactor Chamber [J]. Journal of Synthetic Crystals, 2010, 39(1): 226-232.
[12] 钟树泉, 任晓敏, 王琦, 等. MOCVD反应器热流场的数值模拟研究[J]. 人工晶体学报, 2008, 37(6): 1342-1348.
Zhong Shuquan, Ren Xiaomin, Wang Qi, et al. Numerical Simulation of Flow and Temperature Field in MOCVD Reactor [J]. Journal of Synthetic Crystals, 2008, 37(6): 1342-1348.
[13] Singer P H. Techniques of Low Pressure Chemical Vapor Deposition [J]. Semiconductor International, 1984, 7(5): 72-77.
[14] 关旭东. 硅集成电路工艺基础 [M]. 北京: 北京大学出版社, 2001.
[15] Yao Zhaohui, Yoder G L, Culbertson C T, et al. Numerical Simulation of Dispersion Generated by a 180° Turn in a Microchannel [J]. Chinese Physics B, 2002, 11(3): 226-232.
[16] Mohapatra D R, Rai P, Misra A, et al. Parameter Window of Diamond Growth on GaN Films by Microwave Plasma Chemical Vapor Deposition [J]. Diamond and Related Materials, 2008, 17(7): 1775-1779. |