J4 ›› 2012, Vol. 39 ›› Issue (3): 209-212.doi: 10.3969/j.issn.1001-2400.2012.03.034

• Original Articles • Previous Articles    

Fabrication of the uniaxial stained SOI wafer by mechanical bending

DAI Xianying;WANG Lin;YANG Cheng;ZHENG Ruochuan;ZHANG Heming;HAO Yue   

  1. (Ministry of Education Key Lab. of Wide Band-Gap Semiconductor Materials and Devices, Xidian Univ., Xi'an  710071, China)
  • Received:2011-12-08 Online:2012-06-20 Published:2012-07-03
  • Contact: DAI Xianying E-mail:xydai@xidian.edu.cn

Abstract:

Based on the theory of elasticity and the mechanical properties of SOI, this paper puts forward a new method to produce the uniaxially strained SOI wafer, and describes the principle of the process. The 4-in. Silicon-On-Insulater wafer under goes the mechanical-bended test on the pedestal whose curvature radius is 0.75m, and then it is annealed at 250℃ for 20 hours to achieve the uniaxial strain. The IR-transmission-unaffected-diffraction instrument and Raman spectrum instrument are used for study of the pre-bonding quality and strain degree. The frequency shift of the Raman spectrum is 520.3cm-1.The Si peak of the strained Si layer is shifted by -0.3cm-1 compared to the typical value. It is indicated that a compressive uniaxial strain can be obtained after bending and annealing. The comparative strain is 0.077%, higher than the value of 0.059% in the literature.

Key words: SOI, uniaxial strain, mechanically bending, elastic-plastic mechanics

CLC Number: 

  • TN304