[1] 宋建军, 张鹤鸣, 戴显英, 等. 第一性原理研究应变Si/(111)Si(1-x)Gex能带结构[J]. 物理学报, 2008, 579(9): 5918-5922.
Song Jianjun, Zhang Heming, Dai Xianying, et al. Band Structure of Strained Si/(111)Si(1-x)Gex: a First Principles Investigation[J]. Acta Physica Sinica, 2008, 579(9): 5918-5922.
[2] 冯倩, 郝跃. 新型绝缘体上硅技术的发展与展望[J]. 西安电子科技大学学报, 2001, 28(6): 1-5.
Feng Qian, Hao Yue. Development of SOI Technology on the New Insulator[J]. Journal of Xidian University, 2001, 28(6): 1-5.
[3] 林成鲁, 张苗. SOI——二十一世纪的微电子技术[J]. 功能材料与器件学报, 1999, 5(1): 2-3.
Lin Chenglu, Zhang Miao. SOI—the Microelectronics Technology in the 21st Century[J]. Journal of Functional Materials and Devives, 1999, 5(1): 2-3.
[4] Celler G K, Cristoloveanu S. Frontiers of Silicon-on-insulator[J]. Appl Phys, 2003, 93(9): 4955-4978.
[5] Kim K, Chuang C T, Rim K. Performance Assessment of Scaled Strained-Si Channel-on-insulator (SSOI) CMOS[J]. Solid-State Electronics, 2004, 48(2): 239-243.
[6] Haugerud B M, Bosworth L A, Belford R E. Mechanically Induced Strain Enhancement of Metal Oxide Semiconductor Field Effect Transistors[J] . Applied Physics Letters, 2003, 94(6): 4102-4107.
[7] Himcinschi C, Radu I, Muster F. Uniaxially Strained Silicon by Wafer Bonding and Layer Transfer[J]. Solid-state Electronics, 2007, 51(2): 226-230.
[8] 李同林. 弹塑性力学[M]. 武汉:中国地质大学出版社, 2006: 43-96.
[9] 张新占. 材料力学[M]. 2版. 西安: 西北工业大学出版社, 2006: 4-6.
[10] 秦世伦. 材料力学[M]. 成都: 四川大学出版社, 2008: 51-53.
[11] 李碧波, 黄福敏. 用显微拉曼扫描成像法测集成电路中CoSi2电极引起的应力[J]. 半导体学报, 1998, 19(4): 299-303.
Li Bibo, Huang Fumin. Stress Induced by CoSi2 Grown on Polycrystalline Si Measured by Micro-Raman Spectroscopy[J]. Chinese Journal of Semiconductors, 1998, 19(4): 299-303.
[12] De Wolf I. Stress Induced by CoSi2 Grown on Polycrystalline Si Measured by Micro Raman Spectroscopy[J]. J Raman Spectros, 1999(30): 877-883.
[13] Himcinschi C, Reiche M, Scholz R, et al. Compressive Uniaxially Strained Silicon on Insulator by Prestrained Wafer Bonding and Layer Transfer[J]. Applied Physics Letters, 2007, 90(23): 1-3. |