铜铝复合母线短时耐受能力研究

›› 2016, Vol. 29 ›› Issue (2): 109-.

铜铝复合母线短时耐受能力研究

白志胜,陈建兵,忻尚芝

(1.上海理工大学光电信息与计算机工程学院,上海 200093;2.上海电器科学研究院,上海 200063)

出版日期:2016-02-15 发布日期:2016-02-25
作者简介:白志胜(1989—),男,硕士研究生。研究方向:电器工程。

Short-time Withstand Capability of Copper Aluminum Composite Bus Bar

BAI Zhisheng,CHEN Jianbing,XIN Shangzhi

(1.School of Optical-Electrical and Computer Engineering,University of Shanghai for Science and Technology,Shanghai 200093,China;
2.Shanghai Electrical Apparatus Research Institute,Shanghai 200063,China)

Online:2016-02-15 Published:2016-02-25

摘要/Abstract

摘要：

铜铝复合母线(TLF bus bar)是一种新型复合导体材料,其既保持了铜母线(copper bus bar)表面抗氧化能力强的特点,又利用了铝重量轻,价格低的优点,是替代铜母线的极佳材料。但铜铝复合母线在低压成套设备和母线槽中应用必须对其短时耐受能力进行验证。文中通过理论计算分析了低压成套设备和母线槽中铜铝复合母线承受短耐的能力,并对理论值进行了实验验证。结果显示,铜铝复合母线在低压成套设备和母线槽中应用通过增加绝缘支撑架或改变绝缘夹之间距离L值,可使其满足短时耐受能力的要求,为其在低压成套设备和母线槽中应用提供了理论依据以及解决方案。

关键词: 铜铝复合母线, 短路耐受, 动稳定, 母线槽, 低压成套设备

Abstract:

TLF bus is a new composite conductor material and a good substitute for copper bus bar,which enjoys light weight and low cost of aluminum while maintaining the antioxidant ability of copper busbar surface characteristics.But TLF bus must to validate its short-time withstand capability when used in low voltage complete sets of equipment.The TLF bus short-time withstand capability in low voltage complete sets of equipment and bus duct are studied by theoretical calculation and analysis.Experiments show that TLF bus used in low voltage complete sets of equipment and bus duct meets the requirements of short-time withstand capability by adding insulation brace or change the clip distance L between values,paving the ground for its application in low voltage complete sets of equipment and bus duct.

Key words: copper aluminum composite busbar;short time withstand capability;dynamic stability;bus duct;low voltage complete sets of equipment

中图分类号:

TN304.07

白志胜,陈建兵,忻尚芝. 铜铝复合母线短时耐受能力研究[J]. , 2016, 29(2): 109-.

BAI Zhisheng,CHEN Jianbing,XIN Shangzhi. Short-time Withstand Capability of Copper Aluminum Composite Bus Bar[J]. , 2016, 29(2): 109-.