[1]Kijin Kwon,Sekwang Park.A Bulk-micromachined Three-axis Accelerometer Using Silicon Direct Bonding Technology and Polysilicon Layer[J].Sensors and Actuators,1998,A 66(1-3):250-255.
[2]Puers R,Ryntijens S.Design and Processing Experiments of a New Miniaturized Capacitive Triaxial Accelerometer[J].Sensors and Actuators,1998,A 68(1-3):324-328.
[3]Xie H,Pan Z,Frey W,et al.Design and Fabrication of an Integrated CMOS-MEMS 3-axis Accelerometer[C].San Francisco,CA:Proc.2003 Nanotechnology Conf,2003:292-295.
[4]R Djegard H,Andersson G I.Bulk Micromachining of SOI Wafers Using Double Sided Lithography and Anistropic Wet Ecting[C].Proceeding of SPIE-Micromachining and Microfabrication Process,2000:485-495.
[5]R Djegard H,Andersson G I.Capacitive Slanted-bean Three-axis Accelerometer:I modelling and Design[J].J Micromech Microeng,2005(15):1989-1996.
[6]刘宗林,李圣怡,吴学忠.新型三轴微加速度计设计[J].传感技术学报,2004(3):488-491.
[7]曹新平,张大成,黄如,等.一种大厚度的三轴差分电容式硅微加速度计[J].仪器仪表学报,2002,23(26):572-575.
[8]陈伟平,赵振刚,丁金玲,等.梳齿双轴微机械加速度计的研制[J].传感技术学报,2004,21(4):193-196. |