[1] 汤晓燕, 张玉明, 张义门. 4H-SiC n-MOSFET新型反型层迁移率模型[J]. 西安电子科技大学学报, 2011, 38(1): 42-46.
TANG Xiaoyan, ZHANG Yuming, ZHANG Yimen. New Inversion Channel Electron Mobility Model of the 4H-SiC n-MOSFET [J]. Journal of Xidian University, 2011, 38(1): 42-46.
[2] 韩茹, 杨银堂. 6H-SiC NMOS与PMOS温度特性分析[J]. 西安电子科技大学学报, 2007, 34(1): 16-20.
HAN Ru, YANG Yintang. Analyses of the Temperature Properties of the 6H-SiC NMOS and PMOS[J]. Journal of Xidian University, 2007, 34(1): 16-20.
[3] KAMPITSIS G, PAPATHANASSIOU S, MANIAS S. Comparative Evaluation of the Short-circuit Withstand Capability of 1. 2kV Silicon Carbide(SiC) Power Transistors in Real Life Applications[J]. Microelectronics Reliability, 2015, 55(12): 2640-2646.
[4] OTHMAN D, BERKANI M, LEFEBVRE S, et al. Comparison Study on Performances and Robustness between SiC MOSFET & JFET Devices-Abilities for Aeronautics Application[J]. Microelectronics Reliability, 2012, 52(9/10): 1859-1864.
[5] ROMANO G, FAYYAZ A, RICCIO M, et al. A Comprehensive Study of Short-circuit Ruggedness of Silicon Carbide Power MOSFETs[J]. IEEE Journal of Emerging and Selected Topics in Power Electronics, 2016, 4(3): 978-987.
[6] WANG Z, SHI X, TOLBERT L M, et al. Temperature-dependent Short-circuit Capability of Silicon Carbide Power MOSFETs[J]. IEEE Transactions on Power Electronics, 2016, 31(2): 1555-1566.
[7] NGUYEN T T, AHMED A, THANG T V, et al. Gate Oxide Reliability Issues of SiC MOSFETs under Short-circuit Operation[J]. IEEE Transactions on Power Electronics, 2015, 30(5): 2445-2455.
[8] CHEN C, LABROUSSE D, LEFEBVRE S, et al. Study of Short-circuit Robustness of SiC MOSFETs, Analysis of the Failure Modes and Comparison with BJTs[J]. Microelectronics Reliability, 2015, 55(9/10): 1708-1713.
[9] YOSHIOKA H, SENZAKI J, SHIMOZATO A, et al. Effects of Interface State Density on 4H-SiC n-channel Field-effect Mobility[J]. Applied Physics Letters, 2014, 104(8): 83516.
[10] WANG J, ZHAO T, LI J, et al. Characterization, Modeling, and Application of 10-kV SiC MOSFET[J]. IEEE Transactions on Electron Devices, 2008, 55(8): 1798-1806.
[11] SUN K, WU H, LU J, et al. Improved Modeling of Medium Voltage SiC MOSFET within Wide Temperature Range[J]. IEEE Transactions on Power Electronics, 2014, 29(5): 2229-2237.
[12]CHEN K, ZHAO Z, YUAN L, et al. The Impact of Nonlinear Junction Capacitance on Switching Transient and Its Modeling for SiC MOSFET[J]. IEEE Transactions on Electron Devices, 2015, 62(2): 333-338.
[13] SOMETANI M, OKAMOTO D, HARADA S, et al. Temperature-dependent Analysis of Conduction Mechanism of Leakage Current in Thermally Grown Oxide on 4H-SiC[J]. Journal of Applied Physics, 2015, 117(2): 024505.
[14] SAMANTA P, MANDAL K C. Leakage Current Conduction, Hole Injection, and Time-dependent Dielectric Breakdown of n-4H-SiC MOS Capacitors during Positive Bias Temperature Stress [J]. Journal of Applied Physics, 2017, 121(3): 034501.
[15] OUENNOUGHI Z, STRENGER C, BOUROUBA F, et al. Conduction Mechanisms in Thermal Nitride and Dry Gate Oxides Grown on 4H-SiC[J]. Microelectronics Reliability, 2013, 53(12): 1841-1847.
[16] PEREZ-TMOAS A, BROSSELARD P, GODIGNON P, et al. Field-effect Mobility Temperature Modeling of 4H-SiC Metal-oxide-semiconductor Transistors[J]. Journal of Applied Physics, 2006, 100(11): 114508.
[17] ROZEN J, DHAR S, ZVANUT M E, et al. Density of Interface States, Electron Traps, and Hole Traps as a Function of the Nitrogen Density in SiO2 on SiC[J]. Journal of Applied Physics, 2009, 105(12): 124506. |