BiAgSbCu系高温无铅钎料制备及焊接性能研究

›› 2013, Vol. 26 ›› Issue (10): 91-.

BiAgSbCu系高温无铅钎料制备及焊接性能研究

涂文彬,周光雄

(广东工业大学材料与能源学院,广东广州 510006)

出版日期:2013-10-15 发布日期:2013-10-23
作者简介:涂文彬(1988—),男,硕士。研究方向:Bi基高温无铅钎料制备及性能。E-mail:tuwenbin007@126.com

BiAgSbCu-based High-temperature Lead-free Solder Preparation and its Welding Performance

TU Wen-Bin, ZHOU Guang-Xiong

(School of Materials and Energy,Guangdong University of Technology,Guangzhou 510006,China)

Online:2013-10-15 Published:2013-10-23

摘要/Abstract

摘要：

研制开发熔点在260 ℃以上的高温无铅钎料来代替传统的高铅钎料运用于电子封装一直是钎焊领域的一大难题。熔点约为272 ℃的Bi-2.6 Ag-5 Sb钎料合金因润湿性和焊接可靠性不良在运用上受到限制。文中通过在Bi-2.6 Ag-5 Sb钎料合金中添加微量元素Cu来改善B-i2.6 Ag-5 Sb合金的润湿性及焊接可靠性。研究结果表明,Cu含量对BiAgSbCu系钎料合金熔点影响较小,当Cu含量为2 %时,润湿性及焊接可靠性最佳。

关键词: 高温无铅钎料, 润湿性, 剪切强度, 显微组织

Abstract:

The development of high melting temperature lead-free solder with melting point above 260 ℃ to replace the traditional high lead solder used for electronic packaging has been a major difficulty in the field of soldering.Bi-2.6 Ag-5 Sb solder alloy whose melting point is 272 ℃ is restricted because of its inferior wettability and soldering reliability.In this paper,Cu is added into Bi-2.6 Ag-5 Sb solder alloy to improve the wettability and soldering reliability.The results show that there is no obvious change in the melting points of BiAgSbCu solder alloy with the addition of Cu,while the wettability and soldering reliability of BiAgSbCu solder alloy improve remarkably with the addition of 2%Cu.

Key words: high melting temperature lead-free solder;wettability;shear strength;microstructural

中图分类号:

TN604

涂文彬, 周光雄. BiAgSbCu系高温无铅钎料制备及焊接性能研究[J]. , 2013, 26(10): 91-.

TU Wen-Bin, ZHOU Guang-Xiong. BiAgSbCu-based High-temperature Lead-free Solder Preparation and its Welding Performance[J]. , 2013, 26(10): 91-.