半导体激光切割碳钢板方法研究

›› 2016, Vol. 29 ›› Issue (9): 87-.

半导体激光切割碳钢板方法研究

陈涛，蔡锦达

（上海理工大学机械工程学院，上海 200093）

出版日期:2016-09-15 发布日期:2016-09-26
作者简介:蔡锦达（1963-），男，教授。研究方向：机电一体化。陈涛（1992-），男，硕士研究生。研究方向：金属材料激光加工。

Cutting Carbon Sheets with Direct Diode Laser

CHEN Tao, CAI Jinda

(School of Mechanical Engineering, University of Shanghai for Science and Technology, Shanghai 200093, China)

Online:2016-09-15 Published:2016-09-26

摘要/Abstract

摘要：

采用500 W半导体激光对碳钢板材进行切割实验。为了提高切割能力，针对半导体激光光束发散角较大的特点，以及碳钢板材的激光切割工艺特性，对切割头的光学系统进行改进，并进行比较实验。结果显示，适当增加光斑尺寸，焦深延长，可一定程度上加强半导体激光对于3 mm以上碳钢板的切割能力，将切割厚度拓展到6 mm。在此条件下，切割速度有所下降。但在3～6 mm厚度范围内切割效率同500 W光纤激光器切割效率相近。

关键词: 半导体激光, 碳钢切割, 光束特点, 厚度

Abstract:

Experiments on cutting carbon steel sheets with 500 W diode laser are performed. In order to improve the cutting ability, the optical lens of the cutting head is improved with in mind the big laser beam divergence Angle of diode laser, and the process characteristics of the carbon steel sheet laser cutting. Result shows that properly increasing the spot size and extending the depth of focus improves the ability of the diode laser to cut carbon steel sheets more than 3 mm thick, and cutting speed is decreased at a sheet thickness of 6 mm; within 3~6 mm thickness, the cutting efficiency of diode laser is close to that of the 500 W fiber laser.

Key words: direct diode laser, carbon steel cutting, beam characteristic, thickness

中图分类号:

TN248.4

陈涛，蔡锦达. 半导体激光切割碳钢板方法研究[J]. , 2016, 29(9): 87-.

CHEN Tao, CAI Jinda. Cutting Carbon Sheets with Direct Diode Laser[J]. , 2016, 29(9): 87-.