›› 2018, Vol. 31 ›› Issue (1): 12-.

• 论文 • 上一篇    下一篇

65 nm体硅工艺NMOS中单粒子多瞬态效应的研究

 梁永生, 吴郁, 郑宏超, 李哲   

  1. 1.北京工业大学 信息学部;2.北京微电子技术研究所
  • 出版日期:2018-01-15 发布日期:2018-01-11
  • 作者简介:梁永生(1992-),男,硕士研究生。研究方向:集成电路抗辐射加固。 吴郁(1970-),男,副研究员。研究方向:功率半导体器件。 郑宏超(1983-),男,高级工程师。研究方向:抗辐照加固验证技术。
  • 基金资助:

    国家自然科学基金(61176071)

Research on Single Event Multiple Transient Effect in 65 nm Bulk NMOS

LIANG Yongsheng, WU Yu, ZHENG Hongchao, LI Zhe   

  1. 1.Faculty of Information,Beijing University of Technology;
    2.Beijing Microelectronics Technology Institute
  • Online:2018-01-15 Published:2018-01-11

摘要:

针对NMOS场效应晶体管由重离子辐射诱导发生的单粒子多瞬态现象,参考65 nm体硅CMOS的单粒子瞬态效应的试验数据,采用TCAD仿真手段,搭建了65 nm体硅NMOS晶体管的TCAD模型,并进一步对无加固结构、保护环结构、保护漏结构以及保护环加保护漏结构的抗单粒子瞬态效应的机理和能力进行仿真分析。结果表明,NMOS器件的源结和保护环结构的抗单粒子多瞬态效应的效果更加明显。

关键词: 单粒子效应, 单粒子瞬态, 电荷共享, 抗辐射

Abstract:

Aiming to research the single event multiple transient due to single event charge sharing inducing by heavy-ion radiation in NMOSFET (Negative Channel Material-Oxide-Silicon Field Effect Transistor), a 65nm bulk NMOS model based on TCAD (Technology Computer-Aided Design) simulation has been built , where a SPICE model and a set of date about SET pulse width in inverter chain based on 65 nm bulk CMOS(Complementary Metal-Oxide-Semiconductor Transistor) processes are refer to. Due to charge sharing induced via injection of heavy ion, single event multiple transient was observed in the TCAD simulation. During the process of charge sharing, Observation on electrostatic potential distribution inside the device and current on the port of device reveals that source junction of the NMOS and guard ring structure play significant roles on recovery of single event multiple transient.

Key words: single event effect, single event transient, charge sharing, radiation harden

中图分类号: 

  • TN386