›› 2016, Vol. 29 ›› Issue (6): 92-.

• 论文 • 上一篇    下一篇

基于LTCC基板的X波段四通道T/R组件的设计

戈江娜   

  1. (中国电子科技集团公司第13研究所 第16专业部,河北 石家庄 050001)
  • 出版日期:2016-06-15 发布日期:2016-06-22
  • 作者简介:戈江娜(1974-),女,硕士,高级工程师。研究方向:T/R组件的研发。

The Design of Xband 4channel T/R Module Based on LTCC Substrate

GE Jiangna   

  1. (Sixteenth Professional Department,The 13thResearch Institute of CETC Group Corporation, Shijiazhuang
    050001, China
  • Online:2016-06-15 Published:2016-06-22

摘要:

介绍了一种X波段四通道T/R组件的设计思路和实现方法。针对组件工作频率高、工作频段宽、通道数多、功能复杂、裸芯片多、重量要求严格等难点,组件采用低温共烧陶瓷设计、MCM设计、新型硅铝盒体材料设计等先进技术,成功研制出了低噪声、轻质量、功能齐全的小型化四通道T/R组件,该组件工作带宽在X波段达到2 GHz,发射功率达到+41 dBm,发射效率达到32%,接收噪声系数达到2.5~2.8 dB,移相精度达到20(RMS),整体重量为96 g。组件已实现批量化生产。

关键词: LTCC, MCM, 硅铝材料, 芯片自动粘结, 自动键合

Abstract:

This paper introduces the design idea and the implement method of a kind of Xband fourchannel T/R module.Such advanced technologies as LTCC, MCM and new silicon aluminum material design are adopted in the module, in view of some difficulties such as higher working frequency, broader bandwidth, complex function, more channels, more bare chips, strict weight demand and so on.The miniaturized fourchannel T/R module is developed successfully with low noise figure, light weight, and complete functions. The operation bandwidth can be up to 2 GHz, the transmitting power can reach up to 41 dBm,the transmitting efficiency is as high as 32%, the noise figure is 2.5~2.8 dB, the phase shift precision (RMS value) is 2°, and the whole weigh is only 96 g. The module has been in the stage of mass production.

Key words: LTCC, MCM, silicon aluminum material, chip automatic attaching, automatic bonding

中图分类号: 

  • TN402