[1]陈伯良.红外焦平面成像器件的重大应用[J].红外与激光工程,2005,34(2):168-172.
[2]Toshimitsu ISHII,Yoshizo OKAMOTO.Investigation of qualification,certification and reference testing methods on nondestructive inspection by means of infrared thernography[J].非破坏检查,1999,48(10):642-652.
[3]LEGRAND A C,MERIAUDEAU F.Active infrared non-destructive testing for glue occlusion detection within plastic lids[J].NDT and E International,2002,35(3):177-187.
[4]DATTOMA V,MARCUCCIO R,PAPPALETTERE C,et al.Thermography investigation of sandwich structure made of composite material [J].NDT& E International,2001,34(8):515-520.
[5]袁宏永,赵建华,范维澄.基于热像技术的电缆火险隐患诊断研究[J].中国科学技术大学学报,2000,30(1):108-112.
[6]陈衡.我国红外诊断技术的现状与展望[J].激光与红外,1998,28(5):292-296.
[7]陈衡.电气设备故障红外诊断中的基础研究问题[J].电力情报,1997(1):8-11.
[8]黄飞,于慧敏,杨少林.基于DM642的红外图像实时处理系统的设计[J].电路与系统学报,2008,3(13):116-120.
[9]王兆琦,仇润鹤,尹苏东.基于图像处理的电梯钢丝绳检测系统[J].微计算机信息,2011(7):41-43. |