Electronic Science and Technology ›› 2024, Vol. 37 ›› Issue (3): 68-74.doi: 10.16180/j.cnki.issn1007-7820.2024.03.009

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Thermal Simulation of COB-LED Heat Sink Based on Two-Dimensional Heat Conduction Equation

WANG Chaorui, YANG Ping, HAN Shuai, XU Xinying   

  1. School of Mechanical Engineering,Jiangsu University,Zhenjiang 212013,China
  • Received:2022-10-25 Online:2024-03-15 Published:2024-03-11
  • Supported by:
    National Natural Science Foundation of China(51575246)

Abstract:

For solving the problem about heat dissipation of COB-LED(Chip on Board-Light Emitting Diode), a mathematical model is established based on two-dimensional heat conduction equation which can quickly calculate heat distribution on the surface of COB-LED heat sink in this study. In order to facilitate the solution of the model, the finite difference method is used to solve the mathematical model and the alternate direction implicit scheme is chosen as its difference scheme.According to the boundary conditions and initial conditions in the model, the COB-LED normal temperature lighting experiment is designed, and the simulation analysis is carried out based on ANSYS finite element analysis software. The rationality of the mathematical model is verified by comparing the solution results, simulation results and experimental results. The results show that the relative error of the maximum temperature between the solution result and the experimental results is about 23.57%, and the temperature variation trend of the two is consistent. The maximum temperature relative error between the solution result and simulation results is about 34.84%, and the temperature distribution is close. The rationality and correctness of the mathematical model are proved.

Key words: heat conduction equation, finite difference method, alternative direction implicit scheme, mathematical model, LED heat sink, temperature distribution, experimental validation, simulation analysis

CLC Number: 

  • TN312.8