Stress Relaxation Characteristics and Numerical Simulation of Mn-Cu Alloy under Different Deformation Conditions
XIONG Yajun, LIU Yan, YUAN Xianpu
Electronic Science and Technology . 2024, (8): 47 -53 .  DOI: 10.16180/j.cnki.issn1007-7820.2024.08.007

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