Electronic Science and Technology ›› 2024, Vol. 37 ›› Issue (8): 47-53.doi: 10.16180/j.cnki.issn1007-7820.2024.08.007

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Stress Relaxation Characteristics and Numerical Simulation of Mn-Cu Alloy under Different Deformation Conditions

XIONG Yajun1, LIU Yan1,2, YUAN Xianpu1   

  1. 1. Shanghai Research Institute of Materials Co. Ltd.,Shanghai 200437,China
    2. Shanghai Key Laboratory of Engineering Materials Application and Evaluation, Shanghai 200437,China
  • Received:2023-02-26 Online:2024-08-15 Published:2024-08-21
  • Supported by:
    National Key R&D Program of China(2021YFB3801804);Shanghai Zhangjiang National Innovation Demonstration Zone Special Ddevelopment Fund(ZJ2021-ZD-006)

Abstract:

The improvement of computing power provides a support for finite element simulation analysis, which can solve more complex structures and nonlinear problems more efficiently. In this study, based on the finite element simulation analysis technology, the complex mechanical properties of Mn-Cu alloy are simulated. Prony series constitutive model and parallel rheological constitutive model are respectively adopted to simulate the stress relaxation test of Mn-Cu alloy under different deformation conditions. The stress relaxation experimental data are extracted and converted into the corresponding model parameters and the finite element simulation calculation is carried out. The simulation model parameters which can accurately describe the nonlinear mechanical properties of Mn-Cu alloy are obtained. By comparing the simulation and experimental results, it is concluded that the parallel rheological framework can more accurately characterize the stress relaxation behavior of Mn-Cu alloy. Under different initial strain conditions, the relative error of the simulation results and the test results under corresponding working conditions is less than 1%. Compared with Prony series constitutive model, parallel rheological framework is more suitable for the simulation of Mn-Cu alloy under complex working conditions.

Key words: Mn-Cu alloy, viscoelasticity, nonlinearity, parallel rheological framework, Prony series, finite element, stress relaxation, simulation

CLC Number: 

  • TP391.9