对大功率LED车灯芯片结温部分关键影响因素的研究

doi:10.16180/j.cnki.issn1007-7820.2019.03.015

摘要/Abstract

摘要：

针对LED车灯芯片照明过程中结温过高的问题,文中对影响芯片结温高低的两种关键因素:LED车灯芯片内部发光源间距和芯片排布间距进行研究,以求有效降低芯片结温。通过ANSYS Workbench16.0软件进行芯片热仿真模拟,随后利用恒温测试平台对仿真结果可靠性进行了验证。验证结果表明,合理设置LED车灯芯片内部发光源之间的间距能有效降低芯片结温,最高可降低8.249 ℃;同时,适当增加LED车灯芯片之间排布间距亦可有效降低结温0.5 ℃。

关键词: 结温, LED车灯, 芯片间距, 排布方式, 发光源间距, 管引脚温度

Abstract:

Due to the problem of high junction temperature during the lighting of LED lamp chips,two key factors affecting the junction temperature: distance between the light sources in the LED lamp chip and the spacing between the chips were studied in order to effectively reduce the junction temperature of the chip. This paper used ANSYS Workbench16.0 software for chip thermal simulation and verified the reliability of simulation results by the constant temperature test platform. The simulation results showed that properly setting the spacing between the internal light sources of the LED lamp chip could effectively reduce the chip junction temperature by 8.249℃ while appropriately increasing the spacing between LED lamp chips could also effectively reduce the junction temperature by 0.5℃.

Key words: junction temperature, LED lights, chip spacing, arrangement mode, light source spacing, tube pin temperature

中图分类号:

TN312.8

肖原彬,杨平. 对大功率LED车灯芯片结温部分关键影响因素的研究[J]. 电子科技, 2019, 32(3): 72-76.

XIAO Yuanbin,YANG Ping. Research on the Partial Key Factors Affecting the Junction Temperature of High Power LED Lamp Chip[J]. Electronic Science and Technology, 2019, 32(3): 72-76.

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	L_n			Z-P_m
编号	L₁	L₂	L₃	Z-P₁	Z-P₂	Z-P₃
间距值/mm	0	1	2	0	10	20

名称	材料	热导率/W·(m·k)^-1
热沉	铝	237.5
陶瓷	氧化铝(Al₂O₃)	35
荧光粉	硅树脂	0.17
芯片	氮化镓GaN	130
粘结层	合金焊料(Au₈₀Sn₂₀)	57

芯片间距P_m/mm	0	10	20
Z-M结温/℃	93.108	92.963	92.653
Z-R结温/℃	92.854	92.715	92.436

芯片间排布间距/mm		0	10	20
	Z-P_m-M	85.45	84.65	84.1
实验芯片结温/℃	Z-P_m-R	84.75	84.5	84.3
	L₁	69.2	/	/
	Z-P_m-M	93.058	92.963	92.653
仿真芯片结温/℃	Z-P_m-R	92.854	92.715	92.436
	L₁	75.513	/	/