基于二维热传导方程的COB-LED散热器热模拟

doi:10.16180/j.cnki.issn1007-7820.2024.03.009

摘要/Abstract

摘要：

针对COB-LED(Chip on Board-Light Emitting Diode)散热问题,文中基于二维热传导方程建立了一个可快速计算COB-LED散热器表面热分布的数学模型。为了便于模型求解,采用有限差分法求解该数学模型并选择交替方向隐格式作为其差分格式。根据模型中的边界条件和初始条件设计COB-LED常温点亮实验,并基于ANSYS有限元分析软件进行仿真分析。通过比较求解结果、仿真结果和实验结果验证该数学模型的合理性。结果表明,求解结果与实验结果中最高温度相对误差约23.57%,且两者的温度变化趋势一致。求解结果与仿真结果中最高温度相对误差约34.84%,且温度分布较为接近,证明了该数学模型的合理性与正确性。

关键词: 热传导方程, 有限差分法, 交替方向隐格式, 数学模型, LED散热器, 温度分布, 实验验证, 仿真分析

Abstract:

For solving the problem about heat dissipation of COB-LED(Chip on Board-Light Emitting Diode), a mathematical model is established based on two-dimensional heat conduction equation which can quickly calculate heat distribution on the surface of COB-LED heat sink in this study. In order to facilitate the solution of the model, the finite difference method is used to solve the mathematical model and the alternate direction implicit scheme is chosen as its difference scheme.According to the boundary conditions and initial conditions in the model, the COB-LED normal temperature lighting experiment is designed, and the simulation analysis is carried out based on ANSYS finite element analysis software. The rationality of the mathematical model is verified by comparing the solution results, simulation results and experimental results. The results show that the relative error of the maximum temperature between the solution result and the experimental results is about 23.57%, and the temperature variation trend of the two is consistent. The maximum temperature relative error between the solution result and simulation results is about 34.84%, and the temperature distribution is close. The rationality and correctness of the mathematical model are proved.

Key words: heat conduction equation, finite difference method, alternative direction implicit scheme, mathematical model, LED heat sink, temperature distribution, experimental validation, simulation analysis

中图分类号:

TN312.8

王朝瑞, 杨平, 韩帅, 徐新营. 基于二维热传导方程的COB-LED散热器热模拟[J]. 电子科技, 2024, 37(3): 68-74.

WANG Chaorui, YANG Ping, HAN Shuai, XU Xinying. Thermal Simulation of COB-LED Heat Sink Based on Two-Dimensional Heat Conduction Equation[J]. Electronic Science and Technology, 2024, 37(3): 68-74.

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	初始温度 /℃	时间长度 /s	最高温度 /℃	相对误差 /%
求解结果	16	300	37.27	23.57
实验结果	16	300	30.16	23.57

结构	材料	热导率 /W·(m·K)^-1	比热容 /J·(kg·K)^-1
芯片	GaN	130	730
热沉	铝合金	237	900
基板	陶瓷	35	800
铜基板	铜合金	401	385
导热胶	硅胶	6	830

	初始温度 /℃	时间长度 /s	最高温度 /℃	相对误差 /%
仿真结果	16	3 600	30.80	8.77
实验结果	16	3 600	33.76	8.77

	初始温度 /℃	时间长度 /s	最高温度 /℃	相对误差 /%
求解结果	16	300	37.27	34.84
仿真结果	16	300	27.64	34.84