抗氧化锡纳米粒子的制备方法和热性能研究

›› 2015, Vol. 28 ›› Issue (2): 65-.

抗氧化锡纳米粒子的制备方法和热性能研究

卓新娟,潘志龙

(西安电子科技大学先进材料与纳米科技学院,陕西西安 710071)

出版日期:2015-02-15 发布日期:2015-02-16
作者简介:卓新娟(1990—),女,硕士研究生。研究方向:电子封装材料。E-mail:zhuoxinjuan@163.com

Synthesis and Characterization of Oxide Free Tin Nanoparticles

ZHUO Xinjuan,PAN Zhilong

(School of Advanced Material and Nanometer Technology,Xidian University,Xi'an 710071,China)

Online:2015-02-15 Published:2015-02-16

摘要/Abstract

摘要：

抗氧化锡纳米粒子主要是通过化学还原方法制备而成,文中研究分析了其的尺寸和热学性能。锡纳米粒子的X射线衍射分析结果显示这些纳米粒子并未被氧化,其的示差扫描量热法分析证实了粒子熔点随粒子尺寸变化而变化的情况。同时,测得文中合成的锡纳米颗粒熔点低达202.16 ℃。

关键词: 锡纳米粒子, 抗氧化, 低熔点

Abstract:

Oxide free Tin nanoparticles are synthesized by a chemical reduction method.Their morphological and thermal characterizations are studied.The X-ray diffraction (XRD) study shows that no oxides of Tin nanoparticles are formed.The thermal characterization by differential scanning calorimetry (DSC) exhibits the size dependency of the melting points.The melting point is as low as 202.16 ℃.

Key words: tin nanoparticles;oxide free;low melting point

中图分类号:

TN304

卓新娟,潘志龙. 抗氧化锡纳米粒子的制备方法和热性能研究[J]. , 2015, 28(2): 65-.

ZHUO Xinjuan,PAN Zhilong. Synthesis and Characterization of Oxide Free Tin Nanoparticles[J]. , 2015, 28(2): 65-.

参考文献

［1］Bachels T,Guntherodt H J,Schafer R.Melting of isolated tin nanoparticles［J］.Physics Review Letter,2000,85(6):1250-1253.
［2］Lai S L,Guo J Y,Petrova V,et al.Size-dependent melting properties of small tin particles:nanocalorimetric measurements［J］.Physics Review Letter,1996,77(1):99-102.

［3］Chang S Y,Tsao L C,Wu M W,et al.The morphology and kinetic evolution of intermetallic compounds at Sn-Ag-Cu solder/Cu and Sn-Ag-Cu-0.5Al2O3 composite solder/Cu interface during soldering reaction［J］.Journal of Mater Science:Mater Electronic,2012,23(2):100-107.

［4］Chun Yu,Yang Yang,Peilin Li,et al.Suppression of Cu3Sn and Kirkendall voids at Cu/Sn-3.5Ag solder joints by adding a small amount of Ge［J］.Journal of Mater Science:Mater Electronic,2012,23(2):56-60.

［5］Chuang T H,Wu M W,Chang S Y,et al.Tsao.strengthening mechanism of nano-Al2O3 particles reinforced Sn3.5Ag0.5Cu lead-free solder［J］.Journal of Mater Science:Mater Electronic,2011,22(8):1021-1027.

［6］Hongjin Jiang A,Kyoung-Sik Moon A,Hai Dong A,et al.Size dependent melting properties of tin nanoparticles［J］.Chemical Physics Letters,2006,42(9):492-496.

［7］瞿金蓉,胡明安,陈敬中,等.纳米粒子的熔点与粒径的关系［J］.地球科学:中国地质大学学报,2005(2):195-198.

［8］Carotenuto G,Pepe G P,Nicolais L.Preparation and characterization of nano-sized Ag/PVP composites for optical applications［J］.Euorp Physic Journal B,2006(16):11-17.

［9］Chung Sungyang,Qi Liu,Susan M Kauzlarich.Synthesis and characterization of Sn/R,Sn/Si-R,and Sn/SiO2 Core/Shell Nanoparticles［J］.Chemistry of Materials:Chem Mater,2000,12(4):983-
988.

［10］Chang S Y,Tsao L C,Wu M W,et al.The morphology and kinetic evolution of intermetallic compoundsat Sn-Ag-Cu solder/Cu and Sn-Ag-Cu-0.5Al2O3 compositesolder/Cu interface during soldering reaction［J］.Journal of Mater Science:Mater Electronic,2012,23(2):100-107.

［11］Zou Changdong,Gao Yulai,Yang Bin,et al.Nanoparticles of Sn3.0Ag0.5Cu alloy synthesized at roomtemperature with large melting temperature depression［J］.Journal of Mater Science:Mater Electronic,2012,23(1):2-7.

［12］Caballero A,Morales J,Sanchez L.TinNanoparticles formed in the presence of cellulosefibers exhibit excellent electrochemical performance asanode materials in lithium-ion batteries［J］.Electrochemical and Solid-State Letter,2005,8(9):464-466.

［13］Wang Y,Lee J Y,Deivaraj T C.Controlled synthesis of v-shaped SnO2 nanorods［J］.Journal of Physics Chemical B,2004,108(36):13589-13593.

［14］Schmidt M,Kusche R,Von Issendorff B,et al.Irregular variations in the melting point of size-selected atomic clusters［J］.Physics Letter,1998,39(3):238-240.

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