铜锡合金纳米粒子的制备和性能研究

摘要/Abstract

摘要：

通过化学还原方法制备了铜锡合金纳米粒子,并研究分析了其的尺寸和热学性能。铜锡纳米粒子的X射线衍射分析结果显示,合成产物主要是锡纳米颗粒和铜锡合金(Cu6Sn5)纳米颗粒组成,且这些纳米粒子并未被氧化。其示差扫描量热法测得结果表明,本次合成的纳米颗粒的熔点为202.98 ℃,适合现代电子封装技术对低熔点封装材料的要求。

关键词: 铜锡合金纳米粒子, 封装材料, 低熔点

Abstract:

CuSn nanoparticles are prepared by chemical reduction method,whose sizes and thermal properties are studied.The Xray diffraction analysis results of the product show that the product is constituted primarily by Sn nanoparticles and CuSn nanoparticles (Cu6Sn5),and that the nanoparticles are not oxidized.The differential scanning calorimetry results of CuSn nanoparticles show that the melting point of nanoparticles is 202.98 ℃,very suitable for the low melting point electronic packaging material required by the modern packaging technology.

Key words: CuSn nanoaprticles;packaging material;low melting point

中图分类号:

TN304

韩孟序,潘志龙. 铜锡合金纳米粒子的制备和性能研究[J]. , 2015, 28(5): 108-.

HAN Mengxu,PAN Zhilong. Synthesis and Characterization of CuSn Nanoparticles[J]. , 2015, 28(5): 108-.

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