关键词: 喷射点胶, 微电子封装, 点胶阀, CFD

Abstract:

Glue jetting is the key technology in electronic assembly process.The problem is that how the equipment ejects small dot size during microelectronic encapsulation application.A 2D geometrical model is created to present needle and nozzle impact structure based on working theory of pneumatic actuator.CFD computational fluid dynamic characteristic analysis software is used to simulate glue exit velocity from nozzle orifice and to calculate hydraulic pressure inside compressed chamber.The final simulation results demonstrate that needle tip geometry dimensions and needle stroke and nozzle flared angle are the major factors to affect the jetting speed and ultimately determine the bead size.

Key words: glue jetting;microelectronic encapsulation;actuator;CFD