›› 2016, Vol. 29 ›› Issue (2): 112-.

• 论文 • 上一篇    下一篇



  1. (1.上海交通大学 机械与动力学院,上海 200240;2.诺信(中国)有限公司 工程部,上海 201203)
  • 出版日期:2016-02-15 发布日期:2016-02-25
  • 作者简介:邱中全(1977—),男,硕士研究生,工程师。研究方向:电子组装封装设备。

CFD Analysis of Fluid Dynamic Characteristics in Electronic Assembly

QIU Zhongquan,GUO Changning   

  1. (1.College of Mechanical and Power,Shanghai Jiaotong University,Shanghai 200240,China;
    2.Engineering Department,Nordson (China) Co.,Ltd.,Shanghai 201203,China)
  • Online:2016-02-15 Published:2016-02-25



关键词: 喷射点胶, 微电子封装, 点胶阀, CFD


Glue jetting is the key technology in electronic assembly process.The problem is that how the equipment ejects small dot size during microelectronic encapsulation application.A 2D geometrical model is created to present needle and nozzle impact structure based on working theory of pneumatic actuator.CFD computational fluid dynamic characteristic analysis software is used to simulate glue exit velocity from nozzle orifice and to calculate hydraulic pressure inside compressed chamber.The final simulation results demonstrate that needle tip geometry dimensions and needle stroke and nozzle flared angle are the major factors to affect the jetting speed and ultimately determine the bead size.

Key words: glue jetting;microelectronic encapsulation;actuator;CFD


  • TN305.94