Abstract:

In multilayer printed circuit board (PCB) design,it's often needed to connect the signal from one layer to another through vias,which will arouse signal integrity issues.In this article,we build the signal cross-layer model by using full-wave electromagnetic field simulation tool SIwave,and then analyze its influence on signal transmission from the perspective of power distributed network (PDN) impedance.After that we adopt the method of adding capacitors to optimize the signal transmission path.We give detailed instructions on the selection of capacitance and determination of the location,which may serve as a reference of PCB design.

Key words: return path;power distributed network;SIwave