高速多层PCB板中过孔的建模、仿真及分析

Abstract

Abstract:

High-speed PCB board vias modeling and simulation are made using Hyperlynx software to analyze the influence of the vias on the signals running through them,and an improved and optimized via hole method is proposed.Simulation results show that in the case of requirement of a high line signal integrity,circuits using via holes connection are improved and optimized.

Key words: Hyperlynx;PCB;via

CLC Number:

TP391.9

Cite this article

WANG Yongjun,WANG Junming. Modeling,Simulation and Analysis of Via in High-speed Multilayer PCB[J]., 2013, 26(9): 41-.

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URL: https://journal.xidian.edu.cn/dzkj/EN/

https://journal.xidian.edu.cn/dzkj/EN/Y2013/V26/I9/41

References

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［2］JOHNSON H,GRAHAM M.High-speed signal propagation:advanced black magic［M］.England NJ:Prentice Hall,2003.

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Modeling,Simulation and Analysis of Via in High-speed Multilayer PCB

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