Electronic Science and Technology ›› 2022, Vol. 35 ›› Issue (2): 1-6.doi: 10.16180/j.cnki.issn1007-7820.2022.02.001

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Design and Implementation of High Integration and Miniaturization IF Filter Module

BAI Rui,XU Da,YANG Liang,SUN Congke,WANG Shaodong   

  1. The 13th Research Institute of China Electronics Technology Group Corporation, Shijiazhuang 050051,China
  • Received:2020-10-23 Online:2022-02-15 Published:2022-02-24
  • Supported by:
    National Natural Science Foundation of China(61831016)


To meet the demand of large number and high integration of filters in the IF filter modules of radar receivers, a miniaturization LC filter based on the 3D integration technology is proposed in this study. The application and integrating process of 3D LC filter in modules are studied and analyzed. The 3D LC filter adopts two substrates, and uses 3D integration process and BGA technology to realize the three-dimensional integrated assembly of the two substrates. High-density layout can be realized by placing capacitive elements on the bottom substrate. Inductive elements are placed on the top substrate and separated from the capacitive elements, and signal communication is achieved through solder balls. The use of a three-dimensional integration scheme can reduce the size of the LC filter circuit by nearly 50%, and the filter index is consistent with the performance of the planar filter circuit. Compared with the traditional IF filter component design method, this solution is more conducive to achieve high integration and miniaturization.

Key words: IF filter module, switch filter bank, LC filter, 3D integration, BGA, multi-function, miniaturization, high integration

CLC Number: 

  • TN713