›› 2015, Vol. 28 ›› Issue (8): 47-.

• 论文 • 上一篇    下一篇

基于单片机温度测量的标定方法

陶庆栋,周汉义,黄毅,周如龙   

  1. (合肥工业大学 材料科学与工程学院,安徽 合肥 230009)
  • 出版日期:2015-08-15 发布日期:2015-08-15
  • 作者简介:陶庆栋(1989—),男,硕士研究生。研究方向:自动检测,仪器仪表,材料科学。E-mail:598549039@qq.com

Calibration of Temperature Measurement Based on MCU

TAO Qingdong,ZHOU Hanyi,HUANG Yi,ZHOU Rulong   

  1. (School of Materials Science and Engineering,Hefei University of Technology,Hefei 230009,China)
  • Online:2015-08-15 Published:2015-08-15

摘要:

为提高航空发动机温度测试系统的精度和稳定性,提出了一种基于单片机的实时标定方法。利用热电偶测量温度得到热电动势,放大后通过A/D芯片转换为数字量,下位机通过两次函数拟合获得温度和数字量之间的关系,结合上位机可实现实时温度标定,并具有调零和调满功能。实验结果表明,该标定方法稳定性高、可移植性强,且测量精度可达到0.2 ℃。

关键词: 单片机, 温度, 标定, 上位机, AD7606

Abstract:

In order to improve the accuracy and stability in aero-engine temperature measurement,a real-time calibration method based on MCU is proposed.The thermal electromotive force is measured by thermocouple,and then amplified and converted into digital by ADC.The relationship between temperature and the measured data are formulated by two steps of fitting the function by MCU.Combined with PC,the method can calibrate the temperature with zero-setting and full-setting.The experimental results show that the calibration method has high stability and portability with a measuring precision up to 0.2 ℃.

Key words: MCU;temperature;calibration;PC;AD7606

中图分类号: 

  • TP368